Oxford Instruments Atomfab ALD 原子层沉积系统。Atomfab is a powerful atomic layer deposition (ALD) system tailored for GaN power and RF device manufacturing. It features excellent uniformity, flexibility, and one of the fastest cycle times on the market today.

Oxford Instruments FlexAL ALD 原子层沉积系统。FlexAL atomic layer deposition (ALD) system offers a broad range of high-quality plasma-enhanced ALD and thermal ALD processes with maximum flexibility.

Oxford Instruments PlasmaPro 80 RIE 面向干法刻蚀、等离子体处理与表面清洗场景，页面整理公开资料中的型号、用途和初步选型要点，适合科研检测、材料表征、工艺验证或设备采购沟通。

Oxford Instruments PlasmaPro 800 PECVD PECVD 沉积系统。The PlasmaPro 800 offers a flexible solution for Plasma Enhanced Chemical Vapour Deposition (PECVD) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading system.

Oxford Instruments PlasmaPro ASP 原子层沉积系统。PlasmaPro ASP Shared platform with Atomfab to incorporate remote plasma source to enable low damage plasma ALD with fast cycle times

Oxford Instruments PlasmaPro 80 ICP RIE 反应离子刻蚀系统。The PlasmaPro 80 ICP RIE is a compact, small footprint system offering versatile open load ICP etching solutions with convenient open loading. It is easy to site and easy to use, with no compromise on process quality.

Oxford Instruments PlasmaPro 800 RIE 面向干法刻蚀、等离子体处理与表面清洗场景，页面整理公开资料中的型号、用途和初步选型要点，适合科研检测、材料表征、工艺验证或设备采购沟通。

Oxford Instruments PlasmaPro 80 PECVD PECVD 沉积系统。The PlasmaPro 80 PECVD system is a compact system with open-load design and excellent etch control and rate determination for wafers up to 200mm. PlasmaPro 80 PECD is suitable for silicon nitride & silicon dioxide for photonics, passivation and much more.